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flip mount
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.
I have a Vortex VMX-3T Magnifier with flip-mount in great shape. The VMX-3T comes with the original box and parts. (No trades at this time. Thanks.) Offers considered. Thank you
Vortex Info:
Simple, fast, effective. The push-button design of the VMX-3T engages and disengages the flip-mount...
Been cleaning the safe out of stuff I don't use. This is something I don't use.. I bought it mounted it once, realized I have a astigmatism and can't use red dot, put it in the safe and haven't look at it again. In brand new condition.
Vortex X3 magnifier plus flip mount with box and shim for 1/3 co witness. Excellent condition. Local pickup only @ Burlingame Fred Meyers in Portland off 1-5
Cheers. LETS GO BRANDON