Join the #1 community for gun owners of the Northwest
We believe the 2nd Amendment is best defended through grass-roots organization, education, and advocacy centered around individual gun owners. It is our mission to encourage, organize, and support these efforts throughout Oregon, Washington, Idaho, Montana, and Wyoming.
Discuss firearms and all aspects of firearm ownership
Join others in organizing against anti-gun legislation
Find nearby gun shops, ranges, training, and other resources
Discover free outdoor shooting areas
Stay up to date on firearm-related events
Share photos and video with other members
...and much more!
wlp
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.In conventional technologies, a wafer is diced first, and then individual dies are packaged; package size is usually considerably larger than the die size. By contrast, in standard WLP flows integrated circuits are packaged while still part of the wafer, and the wafer (with outer layers of packaging already attached) is diced afterwards; the resulting package is practically of the same size as the die itself. However, the advantage of having a small package comes with a downside of limiting the number of external contacts that can be accommodated in the limited package footprint; this may become a significant limitation when complex semiconductor devices requiring a large number of contacts are considered.
Fan-out WLP was developed to relax that limitation. It provides a smaller package footprint along with improved thermal and electrical performance compared to conventional packages, and allows having higher number of contacts without increasing the die size.
In contrast to standard WLP flows, in fan-out WLP the wafer is diced first. But then the dies are very precisely re-positioned on a carrier wafer or panel, with space for fan-out kept around each die. The carrier is then reconstituted by molding, followed by making a redistribution layer atop the entire molded area (both atop the chip and atop the adjacent fan-out area), and then forming solder balls on top.
Hey guys, I have some new primers to get rid of. The Berdan’s are really hard to find.
(2) CCI 350 Magnum Large Pistol Primers: 1000ct each box = $100ea
(6) Dynamit Nobel Berdan 5.5 5620 Primers: 250ct each packet = $20ea
Please text for the fastest response:
619.432.5548
Ty!
Todd
large Rifle 2 @ $80
Large pistol for standard or magnum loads 1 @ $80
Please be ready to pickup in a day or 2. I can hold them longer with electronic payment. No shipping. Meet between portland Janzen beach and battleground along I5. Pm to purchase
Winchester W209 Shotshell primers
Winchester Large Rifle WLR
Winchester Large Pistol WLP Standard/Magnum
$90 per 1000. I can meet between Janzen beach and woodland along I5. Have a few of each. Please be ready to pickup within a day or 2. PM (Start a conversation) to buy. I Will respond in...